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The Microwave Newsletter

News for the Microwave and Wireless Engineer

18 January 2017
Message from President Dylan Williams
A Future of Inclusion and Engagement
Out-going President Ke Wu and I share similar visions for the Society. This common ground has led to a close relationship in which I often found myself working to support Ke’s goals, something that I found extremely rewarding: a commitment to inclusiveness, a policy of seeking advice from all corners, a determination to make Society conferences and publications more welcoming to engineers all over the world.

IEEE MTT-S Webinar
3D-/4D-/Inkjet-Printed RF Components and Modules for IoT and Smart Skins
 12:00 p.m.. Eastern, Tuesday, 14 February 2017
 Speaker: Manos M. Tentzeris , Georgia Insitute of Technology
 Moderator: Michael C. Hamilton, Auburn University 

Imaging    THz Spectroscopy Probes Protein Dynamics

Researchers used infrared and terahertz spectroscopy simulations to determine the stability of three cold-shock proteins from heat-loving organisms native to moderate, hot, and very hot environments. Low-frequency oscillating modes correlate with protein stability, with implications for biologically significant behavior.

Honors    J.W. Bandler Named to "Order of Canada"

John William Bandler has been appointed an officer of the Order of Canada for “For his scientific contributions that have helped to position Canada at the forefront of microwave engineering.”

Power    Dual-Band Doherty Power Amplifiers for 5G

New wireless communication standards pose challenges to the traditional RF transmitter chain, creating a demand for highly linear and power-efficient signal application across wide bandwidths. new power amplifier architectures have emerged: envelope tracking, out-phasing, and Doherty.

Call for Papers    Texas Wireless & Microwave Meeting Papers Due 31 Jan.

The 2017 Texas Symposium on Wireless & Microwave Circuits and Systems (Baylor University, Waco, Tex., 30-31 March 2017) welcomes papers in all areas of wireless and microwave circuits and systems. The submission deadline is 31 January.

5G    Verizon and AT&T Prepare to Bring 5G to Market

Verizon and AT&T plan to deliver broadband Internet to select homes or businesses using fixed wireless networks built with early 5G technologies. With biillons on the line, carriers are moving fast. 

Call for Papers    WAMICON 2017 Paper Deadline 6 Feb.

WAMICON 2017, the 18th IEEE Wireless and Microwave Technology Conference (Cocoa Beach, Fla., 24-25 April 2017), welcomes original, high-quality papers on multi- and inter-disciplinary research on wireless and RF technology. The submission deadline is February 6.

Detection    Nonlinear Radar for Finding RF Electronics

An extensive review of non-linear radars capable of detecting RF electronics not originally made as visible radar targets. The state of the art is summarized in high-level system architectures, with their design rationales and specifications.

Call for Papers    First Call for 2017 Compound Semiconductor IC Symposium

Abstracts for the 2017 Compound Semiconductor IC Symposium (Miami, Fla., 22-25 Oct. 2017) are due by 5 May. Papers may cover a wide variety of topics, from materials and device fabrication to design in all frequency regimes, employing InP, GaAs, GaN, Si, Ge, SiGe and other semiconductor materials.

Power    A Highly Linear mmWave CMOS Power Amplifier

A Ka-band highly linear power amplifier (PA) is implemented in 28-nm bulk CMOS technology using a deep class-AB PA topology. In common sources 2-stack configurations, the device demonstrated power-added efficiencies of 27%/25% for LTE and and 16.5%/17.3% for WLAN transmissions.

Coming Up    Microwaves for Intelligent Mobility, Texas Symposium on Wireless & Microwave

Upcoming MTT-S meetings for 2017 include: Microwaves for Intelligent Mobility (Nagoya, 19-21 Mar.); Texas Wireless and Microwave Circuits and Systems (Waco, 30-31 Mar.); Integrated Nonlinear Microwave and Millimeter-wave Circuits (Graz, 20-21 Apr.); Wireless Power Transfer (Taipei, 10-12 May).
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