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Chip-package co-design becomes essential when designing stacked Three-Dimensional Integrated Circuits(3DICs).
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IEEE Robotics News
17 February 2015

FAA Unveils Drone Rules: Autonomy Is In, Drone Delivery Is Out

The U.S. Federal Aviation Administration has recently announced the long-awaited Notice of Proposed Rulemaking for small unmanned aircraft systems, governing the operation of drones under 55 pounds (25 kilograms). Many observers had worried that the FAA would attempt to over-regulate, proposing requirements like airworthiness certificates for drones and pilot’s licenses for drone operators and other restrictions that would make it a lot harder for businesses to use drones. But although there are some sticking points that will surely generate more debate, the proposed rules seem surprisingly reasonable. What do you think?

Engineers must compare inertial and gyro technologies to determine which sensors offer required performance parameters. Learn about a new trio of high performance IMUs from KVH; then download the free guide comparing critical performance areas of fiber optic gyros and MEMS technologies.


Boston Dynamics Has a New Quadruped Robot

The company's new robot is quieter and more agile than BigDog and LS3.

This Flying Robot Just Won a $1 Million Drone Competition

Flyability's cleverly designed drone wins Drones for Good competition.

Fetch Robotics: New Mobile Robots for Logistics

The Unbounded Robotics core team has a new robot startup.

Developing Next-Gen Prosthetic Limbs

DARPA wants amputees to have prosthetics that work just like real arms.

PAL Robotics Introduces Tiago Mobile Manipulator

This robot can pick stuff up and move it around in a research environment.

Can We Detect Drones Like the One in White House Crash?

Yes, we can.

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Download Whitepaper: Accelerated Testing and Failure Diagnosis of High Power Semiconductors using Industrial level Thermal Characterization Methods

Topics include assessing stack material structure degradation or failures by analysis of the heat conduction path, lifetime prediction (greater than 10K cycles into potentially millions) and verifying thermal properties.

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